JPH0611151Y2 - 成形用金型 - Google Patents
成形用金型Info
- Publication number
- JPH0611151Y2 JPH0611151Y2 JP3868689U JP3868689U JPH0611151Y2 JP H0611151 Y2 JPH0611151 Y2 JP H0611151Y2 JP 3868689 U JP3868689 U JP 3868689U JP 3868689 U JP3868689 U JP 3868689U JP H0611151 Y2 JPH0611151 Y2 JP H0611151Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molding
- core
- molding material
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 title claims description 27
- 239000012778 molding material Substances 0.000 claims description 33
- 238000004891 communication Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3868689U JPH0611151Y2 (ja) | 1989-04-01 | 1989-04-01 | 成形用金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3868689U JPH0611151Y2 (ja) | 1989-04-01 | 1989-04-01 | 成形用金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02130312U JPH02130312U (en]) | 1990-10-26 |
JPH0611151Y2 true JPH0611151Y2 (ja) | 1994-03-23 |
Family
ID=31546917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3868689U Expired - Lifetime JPH0611151Y2 (ja) | 1989-04-01 | 1989-04-01 | 成形用金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0611151Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11156894A (ja) * | 1997-12-01 | 1999-06-15 | Sumitomo Wiring Syst Ltd | 射出成形用金型装置 |
-
1989
- 1989-04-01 JP JP3868689U patent/JPH0611151Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02130312U (en]) | 1990-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0341880A3 (en) | A multi-injection molded body, a method of molding and a molding machine | |
CA2203114A1 (en) | Injection of encapsulating material on an optocomponent | |
JPH0611151Y2 (ja) | 成形用金型 | |
JPH0157646B2 (en]) | ||
JPS6097815A (ja) | 成形方法および成形機 | |
JPS58136312U (ja) | 熱可塑性樹脂複合材シートのスタンピング型 | |
JPS5912621U (ja) | 射出成形用金型 | |
JPS63120619A (ja) | 射出成形用金型 | |
JPH0728617U (ja) | 成形型 | |
JPS5664445A (en) | Manufacture of semiconductor device | |
JP2555607Y2 (ja) | 射出成形用金型 | |
JP2673908B2 (ja) | 成型金型 | |
JPH04189118A (ja) | 射出成形方法および射出成形用金形 | |
JPS6337221Y2 (en]) | ||
JPH026113A (ja) | 多孔質弾性部材付き成形品の射出成形型 | |
JPS62178310A (ja) | 成形金型 | |
JP3355756B2 (ja) | 芯材一体射出成形方法 | |
JPS5926322U (ja) | 射出成形用金型 | |
JPH0457172B2 (en]) | ||
JPS6337216Y2 (en]) | ||
JPS6139892B2 (en]) | ||
JP3942231B2 (ja) | 射出成形用金型 | |
JPH0123787Y2 (en]) | ||
JPS6350091Y2 (en]) | ||
JPH058102Y2 (en]) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |